LTC3100
17
3100fb
For more information www.linear.com/LTC3100
PC Board Layout Guidelines
The LTC3100 switches large currents at high frequen-
cies. Special care should be given to the PC board layout
to ensure stable, noise-free operation. You will not get
advertised performance with a careless layout. Figure 1
depicts the recommended PC board layout. A large ground
pin copper area will help to lower the chip temperature.
A multilayer board with a separate ground plane is ideal,
but not absolutely necessary.
A few key guidelines follow:
1. All circulating high current paths should be kept as
short as possible. Capacitor ground connections should
via down to the ground plane in the shortest route
possible. The bypass capacitors on all V
IN
and V
OUT
APPLICATIONS INFORMATION
Figure 1. Recommended Component Placement for Two-Layer PC Board
pins should be placed as close to the IC as possible
and should have the shortest possible paths to ground.
2. To prevent large circulating currents from disrupting the
output voltage sensing, the ground for each resistor
divider should be returned directly to the ground plane
near the IC.
3. Use of vias in the die attach pad of the IC will enhance
the thermal environment of the converter, especially if
the vias extend to a ground plane region on the exposed
bottom surface of the PC board.
4. Keep the connection from the resistor dividers to the
feedback pins as short as possible and away from the
switch pin connections.
16
LTC3100
3100 F01
15 14 13
5 6
8
7
12
11
10
9
1
2
3
4
FBBST
SWBST
V
BST
V
LDO
V
BUCK
SWBK
FBLDO
RUNLDO
FBBK
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